Karen for through hole parts sometimes it is the design rather than the
component i.e. insufficient hole clearances.

I have also found that whoever re-invented through hole on 50 mil pitch
forgot that although you can set up the soldering system to achieve that -
that the components can cause failures due to CAF issues if used in
distributed power systems such as distributed 48 volts on internet switch
blades. 


John Burke
(408) 515 4992


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Karen Tellefsen
Sent: Monday, September 28, 2009 8:34 AM
To: [log in to unmask]
Subject: [TN] What through-hole components cause the most process issues?

This is for all you process engineers.

What though-hole components cause the most trouble:

those with many high density pins

components with a lot of heat capaticty, such as heat sinks, transformers,
etc.?

Anything else?

Do you wave solder glued  SMT components, are any of these problematic?

Thanks for your help.

Karen Tellefsen - Electrical Testing
[log in to unmask]
908-791-3069

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