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September 2009

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Subject:
From:
Phil Nutting <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Phil Nutting <[log in to unmask]>
Date:
Mon, 28 Sep 2009 11:48:15 -0400
Content-Type:
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Karen,

On our boards the TO-220 and TO-247 devices mounted on heat sinks are our biggest problem on wave soldered boards or hand soldered boards.  It doesn't matter if it is tin-lead or lead-free.

Hope this helps.

Phil Nutting
Design for Manufacturing Engineer
Kaiser Systems, Inc.
126 Sohier Road
Beverly, MA 01915
voice: 978-922-9300 x1310
fax: 978-922-8374
e-mail: [log in to unmask]
www.kaisersystems.com


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Karen Tellefsen
Sent: Monday, September 28, 2009 11:34 AM
To: [log in to unmask]
Subject: [TN] What through-hole components cause the most process issues?

This is for all you process engineers.

What though-hole components cause the most trouble:

those with many high density pins

components with a lot of heat capaticty, such as heat sinks, transformers,
etc.?

Anything else?

Do you wave solder glued  SMT components, are any of these problematic?

Thanks for your help.

Karen Tellefsen - Electrical Testing
[log in to unmask]
908-791-3069

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