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| Date: | Mon, 28 Sep 2009 11:35:18 -0400 |
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I would go for the leadless parts, QFN, LLP, etc.
Regards,
Ioan Tempea, ing.
t : 450-967-7100 ext : 244
[log in to unmask]
www.digico.cc
P N'imprimer que si nécessaire - Print only if you must
-----Message d'origine-----
De : Karen Tellefsen [mailto:[log in to unmask]]
Envoyé : Monday, September 28, 2009 11:34 AM
À : [log in to unmask]
Objet : [TN] What through-hole components cause the most process issues?
This is for all you process engineers.
What though-hole components cause the most trouble:
those with many high density pins
components with a lot of heat capaticty, such as heat sinks, transformers,
etc.?
Anything else?
Do you wave solder glued SMT components, are any of these problematic?
Thanks for your help.
Karen Tellefsen - Electrical Testing
[log in to unmask]
908-791-3069
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