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September 2009

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Subject:
From:
stephen gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, stephen gregory <[log in to unmask]>
Date:
Thu, 3 Sep 2009 13:12:14 -0700
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text/plain (81 lines)
Naw. It's gone. I haven't been able to review the security camera tapes with the owner of the laundry mat yet, but even it does show who I think took it, what am I going to do? She'll probably never use that laundry mat again just to avoid me spotting her.
 
Steve

--- On Thu, 9/3/09, Dean Stadem <[log in to unmask]> wrote:


From: Dean Stadem <[log in to unmask]>
Subject: Re: [TN] BGA Pb-free, this is what I feared: Tin whiskers
To: [log in to unmask]
Date: Thursday, September 3, 2009, 2:55 PM


I would not send them to the PA immigrant, they might get stolen!
Just kidding, Steve. Any more developments on that?

R. Dean Stadem
Consulting Engineer
Analog Technologies Corp./Lumagine, Inc.
11441 Rupp Drive
Burnsville, MN 55431
(952)894-9228
[log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Thursday, September 03, 2009 2:16 PM
To: [log in to unmask]
Subject: [TN] BGA Pb-free, this is what I feared: Tin whiskers

We have HASL and via-in-pad. Electrical issues, disturbed signals. There
were hundreds of Tin whiskers on inside of the unfilled vias, and even
whiskers from solder pads circumperiphery, pointing at the nearby solder
pads. I suspect that the signal failures are caused by CAFs. Have any of
you
seen a connection between the presence of Tin whiskers and CAF growth?

All BGA via-in-pads are solder mask defined. If you want photos, I can
send
a couple to the PA immigrant.

/Inge

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