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September 2009

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Subject:
From:
"Glidden, Kevin" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Glidden, Kevin
Date:
Thu, 24 Sep 2009 16:48:23 -0400
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text/plain (80 lines)
I should add that this removes ALL the mask, and will not just reduce thickness. Mask would need to be reapplied if needed.   Also, you can selectively remove masking from pads only via a programmed laser.  Contact Avicenna.
http://www.avicennalaser.com/


-----Original Message-----
From: Glidden, Kevin [mailto:[log in to unmask]]
Sent: Thursday, September 24, 2009 4:41 PM
To: [log in to unmask]
Subject: Re: [TN] Solder Mask Question

If all the mask is over a copper plane, it could be removed by laser.  You cannot remove mask over laminate with laser, to my knowledge.


-----Original Message-----
From: Guy Ramsey [mailto:[log in to unmask]]
Sent: Thursday, September 24, 2009 4:29 PM
To: [log in to unmask]
Subject: Re: [TN] Solder Mask Question

I don't think so.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Thursday, September 24, 2009 3:54 PM
To: [log in to unmask]
Subject: [TN] Solder Mask Question

Eddie,

   Is cured solder mask re-workable.   I want to reduce the overall
solder mask thickness on some finished assembly to expose the ENIG
plated external pads.   The solder mask appear to be thicker than the
copper features,  Is it practical?

Victor,

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