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September 2009

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Subject:
From:
"Carroll, Thomas A" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Carroll, Thomas A
Date:
Wed, 23 Sep 2009 14:29:42 -0700
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text/plain
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text/plain (60 lines)
Joyce,

Each area being Brush Plated is a unique area and a coupon to mirror the surface being plated is not practical.

Regards,
Tom Carroll, CQA, CIT
Supplier Quality Engineer

-----Original Message-----
From: Joyce Koo [mailto:[log in to unmask]] 
Sent: Wednesday, September 23, 2009 4:22 PM
To: TechNet E-Mail Forum; Carroll, Thomas A
Subject: RE: [TN] Adhesion Testing of Brush Plating

Is it suppose to be done on coupon or at qualification stage?  Why you need to do every batch?  If you do, why not have a witness coupon designed along your production part?  

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Carroll, Thomas A
Sent: Wednesday, September 23, 2009 5:20 PM
To: [log in to unmask]
Subject: [TN] Adhesion Testing of Brush Plating

Fellow Techies,

MIL-STD-865D, Selective, Brush Plating, Electro-Deposition calls for Adhesion Testing per paragraph 5.5.6e 1 (tape test) or 2 (shot peen).
But I have a supplier telling me that they do not perform the adhesion test on production application because it would leave a residue.

My question is this:

Do any of you have experience with Selective Brush Plating and if yes, would you recommend allowing the adhesion test to be waived on production hardware?

Thanks in advance for your response,
Tom Carroll, CQA, CIT
Supplier Quality Engineer
Boeing Integrated Defense Systems - East Region Supplier Quality

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