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September 2009

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Wed, 23 Sep 2009 17:22:04 -0400
Content-Type:
text/plain
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text/plain (58 lines)
Is it suppose to be done on coupon or at qualification stage?  Why you
need to do every batch?  If you do, why not have a witness coupon
designed along your production part?  

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Carroll, Thomas A
Sent: Wednesday, September 23, 2009 5:20 PM
To: [log in to unmask]
Subject: [TN] Adhesion Testing of Brush Plating

Fellow Techies,

MIL-STD-865D, Selective, Brush Plating, Electro-Deposition calls for
Adhesion Testing per paragraph 5.5.6e 1 (tape test) or 2 (shot peen).
But I have a supplier telling me that they do not perform the adhesion
test on production application because it would leave a residue.

My question is this:

Do any of you have experience with Selective Brush Plating and if yes,
would you recommend allowing the adhesion test to be waived on
production hardware?

Thanks in advance for your response,
Tom Carroll, CQA, CIT
Supplier Quality Engineer
Boeing Integrated Defense Systems - East Region Supplier Quality

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