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Date: | Wed, 23 Sep 2009 14:20:02 -0700 |
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Fellow Techies,
MIL-STD-865D, Selective, Brush Plating, Electro-Deposition calls for Adhesion Testing per paragraph 5.5.6e 1 (tape test) or 2 (shot peen). But I have a supplier telling me that they do not perform the adhesion test on production application because it would leave a residue.
My question is this:
Do any of you have experience with Selective Brush Plating and if yes, would you recommend allowing the adhesion test to be waived on production hardware?
Thanks in advance for your response,
Tom Carroll, CQA, CIT
Supplier Quality Engineer
Boeing Integrated Defense Systems - East Region Supplier Quality
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