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Subject:
From:
Lee parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee parker <[log in to unmask]>
Date:
Tue, 22 Sep 2009 16:24:41 -0400
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George

I am aware of that, but my suggests have potential application in either case.

Best regards
Lee
J. L. Parker Ph. D.
JLP Consultants LLC
804 779 3389  
  ----- Original Message ----- 
  From: Wenger, George M.<mailto:[log in to unmask]> 
  To: TechNet E-Mail Forum<mailto:[log in to unmask]> ; Lee parker<mailto:[log in to unmask]> 
  Sent: Tuesday, September 22, 2009 3:21 PM
  Subject: RE: [TN] Imm Sn soldering issue.


  Lee,

  Peter is having problems with immersion TIN not immersion SILVER

  Regards,
  George
  George M. Wenger
  Andrew Solutions
  Senior Principal FMA / Reliability Engineer
  40 Technology Drive, Warren, NJ 07059
  (908) 546-4531 [Office]  (732) 309-8964 [Cell]
  [log in to unmask]<mailto:[log in to unmask]>
   
  -----Original Message-----
  From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee parker
  Sent: Tuesday, September 22, 2009 3:03 PM
  To: [log in to unmask]<mailto:[log in to unmask]>
  Subject: Re: [TN] Imm Sn soldering issue.

  Peter you mentioned that the defects are normally on the second side. I
  was also wondering if the defects are usually associated with the same
  features. If so you may have problems other than the immersion silver
  surface. Issues I have uncovered are soldermask residues and soldering
  fixtures (if you are using fixtures) that prevent contact of the board
  and the solder. I suggest that the next time this occurs you process a
  bare board with no no soldermask or fixturing and see if you get the
  same result. Quite often I do not.

  Best regards
  Lee
  J. L. Parker Ph. D.
  JLP Consultants LLC
  804 779 3389
    ----- Original Message ----- 
    From: Peter Barton<mailto:[log in to unmask]<mailto:[log in to unmask]>> 
    To: [log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>> 
    Sent: Tuesday, September 22, 2009 12:33 PM
    Subject: [TN] Imm Sn soldering issue.


    Dear Technetters,

    Hopefully there is someone out there who can help me understand a very
  specific issue we have using PCB's plated with Imm Sn. namely,
  non-wetting of solder to some lands on the second side of population
  after reflow. We have an understanding of this surface finish with
  respect to the assembly processes. We are careful how we handle the
  unpopulated PCB's, the PCB's are shipped directly to the line and are
  only removed from the manufacturer's packaging at the point of use. They
  are not pre-baked and are subjected to 2 relatively benign reflow
  cycles.

    We only ever see the issue on the second side. It occurs on various
  component types. When it does occur the solder deposited at the printing
  stage is reflowed and is attached to the component termination,
  favouring this as more wettable than the PCB land. The problem does not
  always occur. The assembly is populated in 2 up panels and we have
  examples where one panel has soldered joints across the piece, whilst
  the other PCB in the same panel exhibits non wetting in some areas.

    The assembly has been profiled with a good distribution of
  thermocouples on a sample assembly to confirm a low delta T and the
  profile itself is right at the centre of the paste manufacturer's
  recommendations. We like to have a good process window.

    I am aware that the 2 possible reasons for this condition are (a)
  thermal degradation of the finish and (b) possible plating quality
  issues.

    We have dismissed excessive thermal input as these have only been
  subjected to 2 non-RoHS thermal cycles and the PCB's are fresh from the
  manufacturer. Peak temperatures are only around the 227 deg. C mark. The
  Sn thickness specification is 0.8 - 1.2 uM. The applied thickness has
  been measured using XRF as a process control and averages 1.0 uM. I am
  aware that XRF is only a guide as it cannot segregate out 'available'
  pure Sn from Sn/Cu intermetallics.

    We have had an independent lab analysis conducted and example lands
  where this condition is seen are shown to have very little or no
  remaining Sn at the surface, the majority being Sn/Cu intermetallics.
  Other unpopulated plated areas have also been subjected to SEM and EDX
  for comparison and exhibit what is described as 'islands' of Sn in a sea
  of Cu/Sn intermetallics.

    We have not had 'virgin' PCB's analysed yet for comparison as it is
  costly and we are not sure if we would pick the correct example to look
  at - it could be a good one.

    For the PCB experts out there out there I have a couple of questions:

    1. If the application of Sn is a displacement reaction with the
  underlying Cu is there any way that there can be less Sn on some surface
  areas than others?

    2. Are there other reasons that there could be variation in Sn
  deposits or could lead to the 'islands' of Sn as described by our lab
  that is seen after thermal processing?

    3. Are we missing anything else?

    Any questions please feel free to ask - this is causing me the biggest
  headache going.

    Peter Barton
    Senior Process Engineer
    ACW Technology Ltd
    Dinas Isaf West
    Tonypandy
    Mid Glamorgan
    CF40 1XX

    Tel: 01443 425275 (direct)
    Fax 02380 484882
    [log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>

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