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September 2009

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Subject:
From:
Ken Bloomquist <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ken Bloomquist <[log in to unmask]>
Date:
Tue, 22 Sep 2009 11:19:39 -0800
Content-Type:
text/plain
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text/plain (76 lines)
Hi Graham,

Thanks for the comments. The selective solder pallets we generally use are
.25" think material. The boards nest in approximately .05". These parts are
.17"which would on leave about .025 to .03" of the pallet. I would be afraid
that with that thin of material the pallet would have a pretty short life.

Also this part has a large heatsink area that gets soldered to the board
which doesn't leave much space for glue. Does just a little glue between the
leads and the ground plane hold OK?

Thanks again,

Ken 

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: Tuesday, September 22, 2009 12:00 PM
To: TechNet E-Mail Forum; Ken Bloomquist
Subject: RE: [TN] D2PAK-3 Component On Secondry Side

Hi Kenny
We would do it if we can paste attach the part and shield it with a
pallet during wave soldering.  We've done lots of them that way, no
problem.  You've got to ensure the board is laid out such that you can
use a shielding pallet.  

regards,
 - Graham

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ken Bloomquist
Sent: Tuesday, September 22, 2009 3:50 PM
To: [log in to unmask]
Subject: [TN] D2PAK-3 Component On Secondry Side

Has anyone mounted D2PAK-3 components on the secondary side of a mixed
technology board? We have a customer who has a really tight board and
would
like to mount this component on the secondary side. My feeling is that
it is
not a good idea but if any of you have had experience doing this first
hand
I'd love to hear about it.

Best regards,

KennyB

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