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| Date: | Tue, 22 Sep 2009 15:02:46 -0400 |
| Content-Type: | text/plain |
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Hi Kenny,
It may work fine, provided that:
your assembler can use different settings top/bottom in the convection reflow oven (don't know how this functions in Vapor phase or other processes). Getting a lower temp on the bottom will keep the DPAKs in place
the board will not warp when subjected to this differential temp
if the previous do not work, they could glue them
Good luck,
Ioan Tempea, ing.
t : 450-967-7100 ext : 244
[log in to unmask]
www.digico.cc
P N'imprimer que si nécessaire - Print only if you must
-----Message d'origine-----
De : Ken Bloomquist [mailto:[log in to unmask]]
Envoyé : Tuesday, September 22, 2009 2:50 PM
À : [log in to unmask]
Objet : [TN] D2PAK-3 Component On Secondry Side
Has anyone mounted D2PAK-3 components on the secondary side of a mixed
technology board? We have a customer who has a really tight board and would
like to mount this component on the secondary side. My feeling is that it is
not a good idea but if any of you have had experience doing this first hand
I'd love to hear about it.
Best regards,
KennyB
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