No problem, Jon. We all think more clearly after a couple of beers!
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Roberts, Jon (SA-1)
Sent: Tuesday, September 22, 2009 7:55 AM
To: [log in to unmask]
Subject: Re: [TN] CRITERIA FOR USE OF SOLDER SLEEVES
Please ignore my question regarding solder sleeve criteria. I was not
thinking clearly late yesterday. Going home I realized the overlap is
also based on the solder sleeve used (space between the sealing
compound).
The criteria in IPC/WHMA-A-620 does not address using solder sleeves
with joining a component lead and a stranded wire. If I use 8.1.5, it
only states 3 conductor diameters but does not address if it is the
large conductor or smaller conductor.
I am going back to rethink what I need to do. One is to take the
diameter of the 22AWG stranded wire, the diameter of the component lead
and the solder sleeve's opening between the sealing compound to see
which diameter (wire or lead) can meet the 8.1.5 Acceptable.
Sincerely, Jon (Alias dazed)
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Roberts, Jon (SA-1)
Sent: Monday, September 21, 2009 4:37 PM
To: [log in to unmask]
Subject: [TN] CRITERIA FOR USE OF SOLDER SLEEVES
I am trying to determine when using a solder sleeve (heat shrinkable
device) to solder a component lead (solid approximately 0.040" to 0.050
in diameter) to a 22AWG stranded wire the overlap requirement. It is a
T03 transistor.
IPC/WHMA-A-620A
Section 8.1.4 states on 8-8 for a defect less than 3 wire diameters of
the largest wire.
Section 15 covers criteria solder sleeves on shield wire.
So since it is not shown or words about using solder sleeves as a method
of terminations, would you recommend using the requirement in Section
8.1.4 or use the smallest diameter (22 AWG)?
We also do use solder sleeves on resistors which are smaller (0.028") to
solder 22 AWG stranded wires.
Thanks, Jon
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