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Subject:
From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 3 Sep 2009 14:24:32 -0500
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Hi Inge - what is the pwb finish?

Dave Hillman
Rockwell Collins
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Inge <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
09/03/2009 02:15 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Inge <[log in to unmask]>


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Subject
[TN] BGA Pb-free, this is what I feared: Tin whiskers






We have HASL and via-in-pad. Electrical issues, disturbed signals. There 
were hundreds of Tin whiskers on inside of the unfilled vias, and even 
whiskers from solder pads circumperiphery, pointing at the nearby solder 
pads. I suspect that the signal failures are caused by CAFs. Have any of 
you 
seen a connection between the presence of Tin whiskers and CAF growth?

All BGA via-in-pads are solder mask defined. If you want photos, I can 
send 
a couple to the PA immigrant.

/Inge 

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