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September 2009

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Subject:
From:
Vladimir Igoshev <[log in to unmask]>
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Date:
Mon, 21 Sep 2009 22:47:47 +0000
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C-SAM does do a beautiful work on flip-chip packages and of cause not in the transmission mode.



Regards,



Vladimir

SENTEC

SENTEC

11 Canadian Road, Unit 7.

Scarborough, ON M1R 5G1

Tel: (416) 899-1882

Fax: (905) 882-8812

www.sentec.ca





-----Original Message-----

From: "David D. Hillman" <[log in to unmask]>



Date:         Mon, 21 Sep 2009 17:30:36 

To: <[log in to unmask]>

Subject: Re: [TN] Acoustic Microscopy for Under fill Coverage





Hi Bev - I have attempted to use Acoustic Microscopy for underfill 

coverage on BGAs and as other folks have detailed, the number of 

interfaces and structures cause significant signal reflection problems 

making analysis very difficult. Some specific focused interface 

examination efforts can be conducted but are still very difficult to 

analyze.



Dave Hillman

Rockwell Collins

[log in to unmask]









Bev Christian <[log in to unmask]> 

Sent by: TechNet <[log in to unmask]>

09/21/2009 05:16 PM

Please respond to

TechNet E-Mail Forum <[log in to unmask]>; Please respond to

Bev Christian <[log in to unmask]>





To

[log in to unmask]

cc



Subject

Re: [TN] Acoustic Microscopy for Under fill Coverage













John and others,

But wouldn't it be even worse trying to use transmission mode because of 

the nature if the circuit board underneath the component (copper 

barrier(s), glass fiber bundles and epoxy?



Nobody from Sonotek or Sonoscan on TechNet?

Bev



----- Original Message -----

From: John Burke <[log in to unmask]>

To: 'TechNet E-Mail Forum' <[log in to unmask]>; Bev Christian

Sent: Mon Sep 21 18:00:16 2009

Subject: RE: [TN] Acoustic Microscopy for Under fill Coverage





 Not a discontinuity as such just an interface, and you are right, the

signal reflections will be from every interface, so for a BGA (without a

lid) the interfaces will be as follows:



1    Liquid to top of package molding compound

2    Molding compound to silicon

3    Silicon to die attach

4    Die attach to substrate

5    4 or so interfaces in the substrate itself (copper to substrate

pre-preg)

6    Substrate to under fill (or NOT!)



Depending of the acoustic impedance between the Material travelling

from/Material travelling to, more or less ultrasound energy will be

reflected at each of the interfaces.



Of the layers above I believe that the strongest reflection will be from

level 6 above.



It is 30 years since I last played with non destruct testing using

ultrasonics, but I would bet from my experiences then that you would do 

far

better using through transmission for this scenario rather than reflected

signals due to Bev's comment, particularly due to the substrate interface

reflections masking the ones between the package and the under fill.





John Burke

(408) 515 4992





-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian

Sent: Monday, September 21, 2009 2:07 PM

To: [log in to unmask]

Subject: Re: [TN] Acoustic Microscopy for Under fill Coverage



Since when can an acoustic signal punch through a BGA?  I know you can do 

if

for flip chips, but aren't there too many density discontinuities for CSPs

abd BGAs?

Bev



----- Original Message -----

From: TechNet <[log in to unmask]>

To: [log in to unmask] <[log in to unmask]>

Sent: Mon Sep 21 14:40:48 2009

Subject: [TN] Acoustic Microscopy for Underfill Coverage



Anybody know a good lab in the North East that does acoustic microscopy? I

need to verify under fill coverage under BGAs.



Thanks,

Amol











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