We have HASL and via-in-pad. Electrical issues, disturbed signals. There 
were hundreds of Tin whiskers on inside of the unfilled vias, and even 
whiskers from solder pads circumperiphery, pointing at the nearby solder 
pads. I suspect that the signal failures are caused by CAFs. Have any of you 
seen a connection between the presence of Tin whiskers and CAF growth?

All BGA via-in-pads are solder mask defined. If you want photos, I can send 
a couple to the PA immigrant.

/Inge 

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