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September 2009

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From:
"Roberts, Jon (SA-1)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Roberts, Jon (SA-1)
Date:
Mon, 21 Sep 2009 16:37:22 -0500
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I am trying to determine when using a solder sleeve (heat shrinkable
device) to solder a component lead (solid approximately 0.040" to 0.050
in diameter) to a 22AWG stranded wire the overlap requirement.  It is a
T03 transistor.

 

IPC/WHMA-A-620A

 

Section 8.1.4 states on 8-8 for a defect less than 3 wire diameters of
the largest wire.

 

Section 15 covers criteria solder sleeves on shield wire. 

 

So since it is not shown or words about using solder sleeves as a method
of terminations, would you recommend using the requirement in Section
8.1.4 or use the smallest diameter (22 AWG)? 

 

We also do use solder sleeves on resistors which are smaller (0.028") to
solder 22 AWG stranded wires.

 

Thanks, Jon

 

 


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