Since when can an acoustic signal punch through a BGA? I know you can do if for flip chips, but aren't there too many density discontinuities for CSPs abd BGAs?
Bev
----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Mon Sep 21 14:40:48 2009
Subject: [TN] Acoustic Microscopy for Underfill Coverage
Anybody know a good lab in the North East that does acoustic microscopy? I need to verify under fill coverage under BGAs.
Thanks,
Amol
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