Experience and testing have shown that <.046g/mm2  works good. I believe
this number was posted on technet before.
The area refers to the wetted area of the lead i.e. the foot that sits
on the pad.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Braddock, Iain (UK)
Sent: Monday, September 21, 2009 11:00 AM
To: [log in to unmask]
Subject: [TN] Double sided reflow?

Tech's,
 
I know it has been well covered in the past but I urgently need the rule
of thumb formula (surface area/component mass?) for ensuring components
previously soldered on one side won't fall off when subjected to second
side reflowing. I have it somewhere but can I find it...? I have tried
to access the archives and am struggling with passwords, so in the
meantime could anyone help?
 
CIA,
    Iain.

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