Tech's,
 
I know it has been well covered in the past but I urgently need the rule
of thumb formula (surface area/component mass?) for ensuring components
previously soldered on one side won't fall off when subjected to second
side reflowing. I have it somewhere but can I find it...? I have tried
to access the archives and am struggling with passwords, so in the
meantime could anyone help?
 
CIA,
    Iain.

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