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Date: | Fri, 18 Sep 2009 19:30:54 +0200 |
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Is black pad still an enigma?
Inge
----- Original Message -----
From: "Werner Engelmaier /*" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, September 18, 2009 1:02 PM
Subject: Re: [TN] Black Pad
> Hi Linda,
> 'Black Pad,' by definition is unique to ENIG.
> However, there has been some sloppy usage to brittle interfacial failures
> in general. Brittle interfacial separations are possible for almost any
> surface treatment, but they are not 'black pad' which is a high
> concentration of nickel-phosphide at the interface of the Ni-deposit and
> the SnNi-IMC, which weakens this interface.
> Werner
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> -----Original Message-----
> From: Linda Langley <[log in to unmask]>
> To: [log in to unmask]
> Sent: Fri, Sep 18, 2009 6:12 am
> Subject: [TN] Black Pad
>
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> I know we have had this subject many times before so I did go to the
> archives and still can't find an answer. My question, is Black Pad only
> associated with ENIG? Is it possible with immersion Tin?
>
>
>
> Linda Langley CIT
>
> Training Specialist
>
> Jabil Circuit
>
> 248-292-6176
>
>
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Technet Mail List provided as a service by IPC using LISTSERV 15.0
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Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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