It appears that Linda Langley's experience backs up your comment completely.
Rudy Sedlak
RD Chemical Company
--- On Fri, 9/18/09, [log in to unmask] <[log in to unmask]> wrote:
From: [log in to unmask] <[log in to unmask]>
Subject: Re: [TN] Black Pad
To: "TechNet E-Mail Forum" <[log in to unmask]>, "R Sedlak" <[log in to unmask]>
Cc: [log in to unmask]
Date: Friday, September 18, 2009, 6:53 AM
Hi Rudy - actually, if the copper and
tin form an intermetallic phase during your first pass thru the reflow
oven (which they should) then you would have solderability issues during
subsequent soldering operations.
Dave Hillman
Rockwell Collins
[log in to unmask]
R Sedlak <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
09/18/2009 08:44 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
R Sedlak <[log in to unmask]>
To
[log in to unmask]
cc
Subject
Re: [TN] Black Pad
Linda:
Actually, it is quite possible to get black immersion Tin.
It comes from running a bath with an excess of Cupric Copper in it.
I wrote a article on how to monitor Cupric Copper in immersion Tin baths
to avoid this in a recent PCD&F magazine.
The black color should not affect solderability, as it is actually immersion
Copper on top of the Tin.
Rudy Sedlak
RD Chemical Company
--- On Fri, 9/18/09, Linda Langley <[log in to unmask]> wrote:
From: Linda Langley <[log in to unmask]>
Subject: [TN] Black Pad
To: [log in to unmask]
Date: Friday, September 18, 2009, 3:12 AM
I know we have had this subject many times before so I did go to the
archives and still can't find an answer. My question, is Black Pad only
associated with ENIG? Is it possible with immersion Tin?
Linda Langley CIT
Training Specialist
Jabil Circuit
248-292-6176
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