Hi Linda - what soldering processes have you been thru and/or trying to
do?
Dave
"Linda Langley" <[log in to unmask]>
09/18/2009 09:00 AM
To
"TechNet E-Mail Forum" <[log in to unmask]>, <[log in to unmask]>
cc
Subject
RE: [TN] Black Pad
We are having solderability issues, and the pads are black.
Linda Langley CIT
Training Specialist
Jabil Circuit
248-292-6176
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Friday, September 18, 2009 9:54 AM
To: [log in to unmask]
Subject: Re: [TN] Black Pad
Hi Rudy - actually, if the copper and tin form an intermetallic phase
during your first pass thru the reflow oven (which they should) then you
would have solderability issues during subsequent soldering operations.
Dave Hillman
Rockwell Collins
[log in to unmask]
R Sedlak <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
09/18/2009 08:44 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
R Sedlak <[log in to unmask]>
To
[log in to unmask]
cc
Subject
Re: [TN] Black Pad
Linda:
Actually, it is quite possible to get black immersion Tin. It comes
from
running a bath with an excess of Cupric Copper in it. I wrote a
article
on how to monitor Cupric Copper in immersion Tin baths to avoid this in
a
recent PCD&F magazine.
The black color should not affect solderability, as it is actually
immersion Copper on top of the Tin.
Rudy Sedlak
RD Chemical Company
--- On Fri, 9/18/09, Linda Langley <[log in to unmask]> wrote:
From: Linda Langley <[log in to unmask]>
Subject: [TN] Black Pad
To: [log in to unmask]
Date: Friday, September 18, 2009, 3:12 AM
I know we have had this subject many times before so I did go to the
archives and still can't find an answer. My question, is Black Pad only
associated with ENIG? Is it possible with immersion Tin?
Linda Langley CIT
Training Specialist
Jabil Circuit
248-292-6176
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