Hi Rudy - actually, if the copper and tin form an intermetallic phase 
during your first pass thru the reflow oven (which they should) then you 
would have solderability issues during subsequent soldering operations.

Dave Hillman
Rockwell Collins
[log in to unmask]




R Sedlak <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
09/18/2009 08:44 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
R Sedlak <[log in to unmask]>


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Subject
Re: [TN] Black Pad






Linda:
Actually, it is quite possible to get black immersion Tin.   It comes from 
running a bath with an excess of Cupric Copper in it.   I wrote a article 
on how to monitor Cupric Copper in immersion Tin baths to avoid this in a 
recent PCD&F magazine.

The black color should not affect solderability, as it is actually 
immersion Copper on top of the Tin.
Rudy Sedlak
RD Chemical Company

--- On Fri, 9/18/09, Linda Langley <[log in to unmask]> wrote:

From: Linda Langley <[log in to unmask]>
Subject: [TN] Black Pad
To: [log in to unmask]
Date: Friday, September 18, 2009, 3:12 AM

I know we have had this subject many times before so I did go to the
archives and still can't find an answer. My question, is Black Pad only
associated with ENIG? Is it possible with immersion Tin?

 

Linda Langley CIT

Training Specialist

Jabil Circuit

248-292-6176


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