Not necessarily. It depends on the board finish.
Vladimir
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
-----Original Message-----
From: Linda Langley <[log in to unmask]>
Date: Fri, 18 Sep 2009 07:54:10
To: <[log in to unmask]>
Subject: Re: [TN] Black Pad
Werner,
Would the pads and via holes be black if it is brittle interfacial
separation?
Linda Langley CIT
Training Specialist
Jabil Circuit
248-292-6176
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Friday, September 18, 2009 7:02 AM
To: [log in to unmask]
Subject: Re: [TN] Black Pad
Hi Linda,
'Black Pad,' by definition is unique to ENIG.
However, there has been some sloppy usage to brittle interfacial
failures in general. Brittle interfacial separations are possible for
almost any surface treatment, but they are not 'black pad' which is a
high concentration of nickel-phosphide at the interface of the
Ni-deposit and the SnNi-IMC, which weakens this interface.
Werner
-----Original Message-----
From: Linda Langley <[log in to unmask]>
To: [log in to unmask]
Sent: Fri, Sep 18, 2009 6:12 am
Subject: [TN] Black Pad
I know we have had this subject many times before so I did go to the
archives and still can't find an answer. My question, is Black Pad only
associated with ENIG? Is it possible with immersion Tin?
Linda Langley CIT
Training Specialist
Jabil Circuit
248-292-6176
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