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September 2009

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Subject:
From:
Werner Engelmaier /* <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 18 Sep 2009 07:02:10 -0400
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 Hi Linda,
'Black Pad,' by definition is unique to ENIG.
However, there has been some sloppy usage to brittle interfacial failures in general. Brittle interfacial separations are possible for almost any surface treatment, but they are not 'black pad' which is a high concentration of nickel-phosphide at the interface of the Ni-deposit and the SnNi-IMC, which weakens this interface.
Werner


 


 

-----Original Message-----
From: Linda Langley <[log in to unmask]>
To: [log in to unmask]
Sent: Fri, Sep 18, 2009 6:12 am
Subject: [TN] Black Pad










I know we have had this subject many times before so I did go to the
archives and still can't find an answer. My question, is Black Pad only
associated with ENIG? Is it possible with immersion Tin?

 

Linda Langley CIT

Training Specialist

Jabil Circuit

248-292-6176


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