Ditto. Don’t know what I would do without it. Then again, I do. Scrub floors, wash dishes, work at McDonalds….
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Thursday, September 17, 2009 2:20 PM
To: TechNet E-Mail Forum; Stadem, Richard D.
Cc: [log in to unmask]
Subject: Re: [TN] fractured SJs due to soldermask compression
My thinking also. But I have much greater respect for the thinking on this forum.
Thanks to all,
-Chris
"Stadem, Richard D." <[log in to unmask]>
"Stadem, Richard D." <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
09/17/2009 03:05 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
"Stadem, Richard D." <[log in to unmask]>
To
[log in to unmask]
cc
Subject
Re: [TN] fractured SJs due to soldermask compression
I would not think so. The solder connection is made around the circumference of the connector lead between the pad and the lead on both sides of the PWB, and extends down through the plated through hole. If you have at least 75% hole fill with a good solder joint on top of the pad on at least one side, it is much more mechanically robust compared to a small amount of solder sandwiched between two pads for a BGA connection.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Ball
Sent: Thursday, September 17, 2009 1:54 PM
To: [log in to unmask]
Subject: Re: [TN] fractured SJs due to soldermask compression
Hello to All,
I asked this with thoughts unrelated to BGA's. We have selective wave
solder process on some assemblies with pth connectors. As we move to
leadfree, we review our processes and practices and have thought to change
to soldermask defined pads for PbFree selective solder of pth conectors.
I was reviewing a document about this and reading my technet email at the
same time, so the possibility of a problem with soldermask defined pads
alarmed me.
Does a soldermask defined pad reduce solder joint cycles-to-failure in a
pth, selective wave scenario?
Thanks again,
-Chris
Werner Engelmaier
/*
<[log in to unmask] To
OM> [log in to unmask]
Sent by: TechNet cc
<[log in to unmask]>
Subject
Re: [TN] fractured SJs due to
09/17/2009 02:48 soldermask compression
PM
Please respond to
TechNet E-Mail
Forum
<[log in to unmask]>
; Please respond
to
[log in to unmask]
M
Indeed, it is.
Werner
-----Original Message-----
From: Stadem, Richard D. <[log in to unmask]>
To: [log in to unmask]; [log in to unmask]
Sent: Thu, Sep 17, 2009 2:36 pm
Subject: RE: [TN] fractured SJs due to soldermask compression
Thanks, Werner.
I think I understand this a little better. If the soldermask-defined pad
does
not allow the solder to flow down around the sides of the pad, but rather
induces a stress riser where the BGA solderball meets the top of the pad,
the
stress is focused at the point where the solder contacts the pad, at the
top of
the pad. Therefore it is easier for the crack to form as opposed to a
solder
ball that is "anchored" with the pad fully embedded inside the solder ball.
So
the CTE-induced stresses are not from the mask, but the CTE delta between
the
BGA package and the substrate. Being that this stress riser is
circumferential
around the point where the solder makes contact with the pad, the
initiation
point and the direction of the crack propagation can be anywhere and go in
any
direction. Is that correct?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Thursday, September 17, 2009 1:22 PM
To: [log in to unmask]
Subject: Re: [TN] fractured SJs due to soldermask compression
Hi Dean,
Let us be clear about this.
If you have soldermask-defined pads (SMDs), what results is solder joints
with
geometries defined by that solder mask. These geometries cause st
ress
concentrations which typically will cause cycles-to-failure to be cut by
about
half. It has nothing to do with CTE expansion and contraction of the solder
mask—unless, you do solder mask repair after assembly (!?) and the solder
mask
fills the space between component and PCB.
Werner
-----Original Message-----
From: Stadem, Richard D. <[log in to unmask]>
To: [log in to unmask]; [log in to unmask]
Sent: Thu, Sep 17, 2009 1:49 pm
Subject: RE: [TN] fractured SJs due to soldermask compression
Werner,
What I am trying to say is that issues of ground plane configuration will
probably not lead to a reliability issue directly, unless they cause issues
during reflow of the BGA. But if the ground pour is done using
soldermask-defined pads, the soldermask-defined pads can lead to premature
failure of the SJ. My understanding (gained from a direct question I asked
you
in your class) was that the soldermask can constrict the solder during CTE
expansion and contraction. Did I not understand you correctly?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Thursday, September 17, 2009 12:32 PM
To: [log in to unmask]
Subject: Re: [TN] fractured SJs due to soldermask compression
Hi Chris,
First, never heard of "fractured SJs due to soldermask c
ompression during cyclic
operation"—solder mask is much too soft and too thin; now, if you talk
encapsulants that is a different story.
Second, "all of the other
issues pale in the face of fractured SJs due to
soldermask compression during cyclic operation"—even if it were an issue, a
failure is a failure is a failure—'nough said.
Werner
-----Original Message-----
From: Chris Ball <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, Sep 17, 2009 1:07 pm
Subject: [TN] fractured SJs due to soldermask compression
Hello,
Starting a new branch here.
"All of the other issues pale in the face of fractured SJs due to
soldermask compression during cyclic operation."
Is this concern specifically for BGAs, or the same for any soldermask
defined pad, even including selectively waved through-hole (PbFree)?
Thanks,
-Chris
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