TECHNET Archives

September 2009

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Leland Woodall <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Leland Woodall <[log in to unmask]>
Date:
Thu, 17 Sep 2009 11:21:59 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (87 lines)
Ioan,

I wouldn't be as concerned with pad dewets as I would be with those that occur in and around component terminations and leads.  I'd still perform a visual verification to assure that I'm getting good wetting angles in these areas.

In IPC-A-610 paragraph 5.2.5, the explanation of dewetting is only classified as a defect if it causes the connection to not meet the SMT or through-hole solder fillet requirements.

At least that's how I personally interpret it...

Leland

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Thursday, September 17, 2009 10:45 AM
To: [log in to unmask]
Subject: [TN] IPC-610 vs lab results

Dear Technos,

 

I have to get out of this situation regarding the quality of certain boards:

·         On one hand certain pads have the visual aspect of dewetting, being, once again, visually just like in Figure 5-41 para 5.2.5 of IPC-610

·         On the other hand I have 2 lab reports, reputed labs, saying the joints are reliable (good wetting angles and IMC)

 

The visual confusion comes from the excessive length of the pads, the solder kinda fades away before reaching the tip of the pads, but everything looks very well in the component pin area.

 

The question is: is there any IPC document stating something like "IPC-610 is a visual guide only, lab results overrule it"? Otherwise said, the joint quality is there, proved by x-sectioning, so why bother with the visual aspect.

 

Thanks,

 

Ioan Tempea, ing.

Ingénieur Principal Fabrication / Sr. Manufacturing Engineer 

 

 

30 ans déjà! - 30 years already!

950 rue Bergar, Laval, Québec, H7L 5A1

t : 450-967-7100 ext : 244

Mtl : 514-990-5762

f : 450-967-7444

[log in to unmask] <mailto:[log in to unmask]> 

www.digico.cc <http://www.digico.cc/> 

P N'imprimer que si nécessaire - Print only if you must

 


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2