IPC 7095, BGA Technology by Lau. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Toby Carrier
Sent: Tuesday, September 15, 2009 8:45 PM
To: [log in to unmask]
Subject: [TN] Ground Pour Under BGA

Hello all,

Is it a good idea to create a top layer ground flood under a BGA package? I
am 
guessing that the fanout will not allow much area for the ground pour, am I 
correct in thinking so? Does anyone have any good reference info on this
topic?

Also, if you don't have a ground pour under the BGA, how will that affect
the 
impedance control of the traces going to the BGA ball?

Thanks for the help,

Toby

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