Hello all,

Is it a good idea to create a top layer ground flood under a BGA package? I am 
guessing that the fanout will not allow much area for the ground pour, am I 
correct in thinking so? Does anyone have any good reference info on this topic?

Also, if you don't have a ground pour under the BGA, how will that affect the 
impedance control of the traces going to the BGA ball?

Thanks for the help,

Toby

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