Hi Chris,
The allowable moisture content depends primarily on the temperature your PCB will reach during the soldering process—the higher T the lower the allowable moisture content. some material suppliers make recommendations, see e.g. Isola Technical Belletin, “PCB Packaging for Lead-Free Assembly,” September 2007, 5 pages, available from www.isola-group.com.
Also, I developed a White Paper "Recommendations for PCB FAB Notes and Specifications in Printed Circuit Board Drawings for SnPb and Lead-Free Soldering Assemblies, the Qualification of PCB Shops and Activities to Assure Continued Quality" that among many other things contains an extensive discussion on PCB moisture content.
Werner


 


 

-----Original Message-----
From: Chris Schaefer <[log in to unmask]>
To: [log in to unmask]
Sent: Fri, Sep 11, 2009 4:51 pm
Subject: [TN] Bare Board Moisture Content Standard










Hello fellow techies,

My question today concerns allowable moisture content by percentage and if 
there is a standard that applies to the varying materials used to make fabs. 
We are in the process of creating a flow down document to our board houses 
to ensure boards are stored, packaged and handling appropriately prior to 
delivery to us. I have been unable to find a standard that has any information 
in regards to this, but have been told there is one. I'm hoping you all couls 
shed some light on the subject.

Thanks in advance and have a great weekend.

Ciao!

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