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September 2009

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Subject:
From:
Chuck Brummer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 11 Sep 2009 10:33:18 -0700
Content-Type:
text/plain
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Louis,

Are you using caustic or an amine based stripper.  I have experienced 
metal re-deposit from both acid and basic cleaning solutions of both 
aluminum on copper and copper on gold.

  Chuck Brummer
3M Manufacturing Engineer
8357 Canoga Ave.
Canoga Park, CA 91304-2605
(818) 734-4930




From:
Louis Hart <[log in to unmask]>
To:
[log in to unmask]
Date:
09/11/2009 08:57 AM
Subject:
[TN] tin redeposit???
Sent by:
TechNet <[log in to unmask]>



Technetters, hoping this question is not too arcane, has anyone 
experienced sporadic tin redeposit on exposed copper surfaces during the 
photoresist stripping process prior to final ammoniacal etching? In this 
case electroplated tin is used as an etch resist.

Thanks for any comments.

Louis Hart
Compunetics
Monroeville, PA
USA
[log in to unmask]<mailto:[log in to unmask]>
412-858-1272

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