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September 2009

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Subject:
From:
Louis Hart <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Louis Hart <[log in to unmask]>
Date:
Fri, 11 Sep 2009 11:57:20 -0400
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Technetters, hoping this question is not too arcane, has anyone experienced sporadic tin redeposit on exposed copper surfaces during the photoresist stripping process prior to final ammoniacal etching? In this case electroplated tin is used as an etch resist.

Thanks for any comments.

Louis Hart
Compunetics
Monroeville, PA
USA
[log in to unmask]<mailto:[log in to unmask]>
412-858-1272

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