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September 2009

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TechNet E-Mail Forum <[log in to unmask]>, Ken Bloomquist <[log in to unmask]>
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Tue, 22 Sep 2009 15:18:50 -0400
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TechNet E-Mail Forum <[log in to unmask]>, Guy Ramsey <[log in to unmask]>
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Will the through hole be hand soldered post reflow, or are you thinking of
waving them?
I would not do that. 

I think we have pasted placed and reflowed them then populated the primary
side and reflowed it. My recollection is they have enough solderable surface
area to stay in place. But, the tab plane and the paste stencil must be
properly designed or the part will float and may result in leads being less
than target placement after reflow. 



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ken Bloomquist
Sent: Tuesday, September 22, 2009 2:50 PM
To: [log in to unmask]
Subject: [TN] D2PAK-3 Component On Secondry Side

Has anyone mounted D2PAK-3 components on the secondary side of a mixed
technology board? We have a customer who has a really tight board and would
like to mount this component on the secondary side. My feeling is that it is
not a good idea but if any of you have had experience doing this first hand
I'd love to hear about it.

Best regards,

KennyB

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