Hello John,

we have experience with Nickel-Gold-plated boards for more then 15 years
now, first with SnPb and now as well with leadfree solder. Solder joints on
those boards look allways different to what you are used to see using SnPb
on tined boards. The reason is that the tin-gold alloy, which is only an
extreme low quantity within the solder joint, apeares at the surface. But
there is no difference in realibility due to our experience and this was as
well reported in many papers in the meantime.
Most important for production people is to learn to accept this difference
and e.g. to use the wetting angle as criteria for a good or bad solder
joint. 

Best regards

Wolf-Dieter Schmidt
Industrial Engineering
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THALES Defence Deutschland GmbH
Defence Solutions & Services
Ostendstrasse 3
D-75175 Pforzheim - Germany
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Phone: +49 7231 15 3386
Fax: +49 7231 15 3390
mailto: [log in to unmask]
http://www.thalesgroup.com

Registered Seat: Berlin
Commercial Register Charlottenburg HRB 93875 B
Managing Directors: Dr. Markus Hellenthal (Chairman), Peter Obermark
Chairman of the Supervisory Board: Bruno Rambaud


> -----Original Message-----
> From: John Sekene [mailto:[log in to unmask]] 
> Sent: Friday, September 04, 2009 6:00 AM
> To: [log in to unmask]
> Subject: [LF] Gold vs Leadfree
> 
> 
> Wonder if anyone could help....
> 
> I just recently started using gold tinted PCB's with 
> leadfree. I didn't get the result I was expecting, meaning 
> the final end product solder ability looked dull. We have had 
> to rework at least 40% of the PCBs.
> 
> What is the criteria for lead free profile using gold surface 
> finishes PCBs? Am I using the correct profile?
> 
> The profile I'm using is 175/200/290 oC
> 
> Thanks.
> 
> John Sekene
> 
> Compuspec Industries Ltd
> 3-4 Rakino Way
> Mt Wellington
> Auckland
> New Zealand
> 
> Ph: 649 918 1990
> Fax: 649 918 1970
> Http://www.compuspec.com
> 
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