Hi David!
Boy, you sure have brought backs some memories for me! I'm trying to
remember how it was that I first discovered the TechNet, and for the life of
me I can't remember. However it was, it has been the one constant in all of
my jobs over the years from California, to Oklahoma, to Pennsylvania where I
find myself now. It's really remarkable when I think about it.
I have never thanked you for your incredible vision in creating this forum,
because I never knew it was you who started TechNet. One day I would like to
shake your hand personally and express my thanks. But until then, you have
no idea how much the TechNet has been a part of my career in electronics.
Not only have I been helped with countless issues encountered in my job, I
have made so many friends from all over the world. My heartfelt thanks goes
out to you! You done good David!
Steve Gregory
----- Original Message -----
From: "David Bergman" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, September 04, 2009 1:59 PM
Subject: Re: [TN] BGA/LGA land shape versus assembly yield reliability
Hi Inge,
The formation of Technet was my idea. It came during a brainstorming
discussion with one of our TAEC Chairs Al Sorkin on how IPC should start
communicating using something called "e-mail" and get involved in the world
wide web. Al talked about email reflectors which led to the thought of
having a networking tool for the members to ask technical questions. That
lead us to install our "Pine" email system and early registration of the
domain www.ipc.org. Time frame was early nineties, I would have to really
dig to get more specific. We have technet archives back to 1995. I believe
95 and 96 were ported over. A post by Steve Gregory of Pragmatech on
25-APR-95 implies that it had been running for a bit.
Good day!
First I would like to express my thanks for the inputs I have received
in response to several of my requests in the past. They have all been very
helpful in resolving the issues that I needed help on, or when I needed
"another voice" to echo my position on certain issues. I think we all get
busy and sometimes neglect to acknowledge the efforts of others.
/ / \(..)/ ----- *
Steve Gregory
////// ' \/ ` ---- *
[log in to unmask]
*/*/ * // : : --- *
Pragmatech Incorporated
* /` '-- *
101 Nicholson Lane
*//..\\
San Jose, California 95134
Best regards,
Dave
David W. Bergman 大山人
Vice President, International Relations
IPC - Association Connecting Electronics Industries
3000 Lakeside Drive Suite 309 S Bannockburn, IL 60015-1249 USA
+1 847-597-2840 tel
+1 847-615-5640 fax
+1 847-867-1388 mobile
[log in to unmask]
www.ipc.org
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Friday, September 04, 2009 12:40 PM
To: Listserv Technet
Subject: Re: [TN] BGA/LGA land shape versus assembly yield reliability
What about the decomposition time for TechNetium? Seems to be a very stable
element , because we are same number of members since the start. A thought
came up in my mind: when did TN start and who was the creator ?
/Inge
----- Original Message -----
From: "Werner Engelmaier /*" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, September 04, 2009 4:12 PM
Subject: Re: [TN] BGA/LGA land shape versus assembly yield reliability
> Hi Joe,
>
> In the '80's, we at Bell Labs tries round, and rectangular pads. The ATC
> results showd a slight reliability advantage for solder joints resulting
> from rectangular pads. I have a paper in SMI sometimes in the early '90's
> [Bell Labs management would not let it be published at the time] with the
> data. The reason for the rectangular pads , by the way, was smaller
> possible pitch.
>
> Werner
>
>
> -----Original Message-----
> From: Joe Fjelstad <[log in to unmask]>
> To: [log in to unmask]
> Sent: Thu, Sep 3, 2009 8:10 pm
> Subject: [TN] BGA/LGA land shape versus assembly yield reliability
>
>
>
>
> Greetings folks.
>
> I did a quick check of the archives on the subject and drilled a dry well
> (maybe drilled in the wrong place?).
>
> That said, in design and lay out we all tend to match pad shapes on the
> board with their mates on the package (round hole - round peg , square
> hole -
> square peg)
>
> My question is has anyone looked at (or know of) round with square and
> vice versa and collected assembly efficacy/results and/or reliability
> data?
>
> Finite Element Modeling data would be of interest as well.
>
> Thanks in advance for any responses
>
> Joe
>
> Since its Friday in some place of the world (or soon will be) I was
> looking
> over the period table recently and afterwards was wondering if anyone had
> ever mentioned that this little forum has it very own element,
> TechNetium,
> the first man made element. (the upper case N is my suggestion for future
> spelling... ;-)
>
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