I would not send them to the PA immigrant, they might get stolen!
Just kidding, Steve. Any more developments on that?

R. Dean Stadem
Consulting Engineer
Analog Technologies Corp./Lumagine, Inc.
11441 Rupp Drive
Burnsville, MN 55431
(952)894-9228
[log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Thursday, September 03, 2009 2:16 PM
To: [log in to unmask]
Subject: [TN] BGA Pb-free, this is what I feared: Tin whiskers

We have HASL and via-in-pad. Electrical issues, disturbed signals. There
were hundreds of Tin whiskers on inside of the unfilled vias, and even
whiskers from solder pads circumperiphery, pointing at the nearby solder
pads. I suspect that the signal failures are caused by CAFs. Have any of
you
seen a connection between the presence of Tin whiskers and CAF growth?

All BGA via-in-pads are solder mask defined. If you want photos, I can
send
a couple to the PA immigrant.

/Inge

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