We have HASL and via-in-pad. Electrical issues, disturbed signals. There
were hundreds of Tin whiskers on inside of the unfilled vias, and even
whiskers from solder pads circumperiphery, pointing at the nearby solder
pads. I suspect that the signal failures are caused by CAFs. Have any of you
seen a connection between the presence of Tin whiskers and CAF growth?
All BGA via-in-pads are solder mask defined. If you want photos, I can send
a couple to the PA immigrant.
/Inge
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