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September 2009

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From:
Karen Tellefsen <[log in to unmask]>
Date:
Mon, 28 Sep 2009 11:34:08 -0400
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TechNet E-Mail Forum <[log in to unmask]>, Karen Tellefsen <[log in to unmask]>
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This is for all you process engineers.

What though-hole components cause the most trouble:

those with many high density pins

components with a lot of heat capaticty, such as heat sinks, transformers,
etc.?

Anything else?

Do you wave solder glued  SMT components, are any of these problematic?

Thanks for your help.

Karen Tellefsen - Electrical Testing
[log in to unmask]
908-791-3069

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