This is for all you process engineers.
What though-hole components cause the most trouble:
those with many high density pins
components with a lot of heat capaticty, such as heat sinks, transformers,
etc.?
Anything else?
Do you wave solder glued SMT components, are any of these problematic?
Thanks for your help.
Karen Tellefsen - Electrical Testing
[log in to unmask]
908-791-3069
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