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September 2009

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R Sedlak <[log in to unmask]>
Date:
Fri, 18 Sep 2009 13:26:37 -0500
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TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
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"David D. Hillman" <[log in to unmask]>
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TechNet E-Mail Forum <[log in to unmask]>
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Hi Rudy - ya gotta love Technet - I have never understood how I could get 
a layer of copper on top of immersion tin and now I do! I always knew what 
the impact was on soldering but never had a root cause for where the 
copper originated.  Your explanation fills in a knowledge gap for me.

Davee



R Sedlak <[log in to unmask]> 
09/18/2009 12:52 PM

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TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
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Re: [TN] Black Pad







Dave:

It appears that Linda Langley's experience backs up your comment 
completely.
Rudy Sedlak
RD Chemical Company


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