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September 2009

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Designers Council Forum <[log in to unmask]>, "Anderson, Veronika" <[log in to unmask]>
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Wed, 30 Sep 2009 09:17:33 -0400
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"(Designers Council Forum)" <[log in to unmask]>, James Mahoney <[log in to unmask]>
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With 2oz externally starting with 7/7 works best for most factories. With new equipment these days 5/5 may be OK for some factories but risky with spacing issues.

www.quickturnflex.com
Thank you, 
Jim Mahoney 
Quick Turn Flex Circuits, LLC 
Applications Project Manager 
P# 603-821-7071
M# 603-305-6250 
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-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Anderson, Veronika
Sent: Tuesday, September 29, 2009 4:59 PM
To: [log in to unmask]
Subject: [DC] Minimum Surface Conductor Thickness

Help needed in interpretation of IPC-6012.

Appendix A (page 37) calls out Table 3-8 and Paragraph 3.6.2.13 for
External Conductor Minimum Thickness after plating.

Table 3-8 shows that Minimum Surface Thickness after processing is 3.295
mils when the starting foil weight is 2 Oz.

Our company specifies the finished copper weight as 2 Oz on the drawing.
We do not specify the starting foil weight. PCB manufacturer is allowed
to choose a material that he has in stock and plate it up to be 2 Oz.

My question is - What minimum surface conductor thickness after
processing shall be targeted if the starting foil weight is not 2 Oz?
(The PWB house insists on having the conductor thickness 2.8 mils after
processing. However, I cannot find such a number in IPC-6012.)
  
Thank you,   

Veronika Anderson, C.I.D.
Senior Electrical / Mechanical Designer
 
PerkinElmer Optoelectronics
1330 East Cypress St.,
Covina, CA 91724
Phone: (626) 967-9521 X 236
E-mail: [log in to unmask]
 

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