Victor,
Go back to the Assist site https://assist.daps.dla.mil/online/start/
and try it again as Mil-PRF-38535 - Rev H will pop up
So does Mil-M-38510
If you continue to have problems drop me a line off-net.
My recollection of 38535 is that it will refer back to Mil Std 883, et.al.
for specifics
38510 will list a bunch of test criteria, test regimes, but as you found -
no pics.
To a large extent, the Mil Std's just set the MINIMUM baselines. For making
Mil stuff, you are generically free to establish your own minimum
specifications so long as they are at least as stringent as the Mil Std.
A big example of this is wire pull criteria. The floor would have been shut
down long long before ever getting down to the minimum requirements of the
Mil Std! Most houses will be this way.
Regarding cracks in the base of a power chip - I still maintain that is
something to be well avoided, but do not have a public document that
specifies that.
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Thursday, August 06, 2009 9:38 AM
To: [log in to unmask]
Subject: Re: [TN] die base chip outs / fractures
I was not able to retrieve MIL-PRF-38535F from the data base, doc not
found. MIL-M-38510 did not include photos/sketches of acceptance
anomalies. Any other suggestions.
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Wednesday, August 05, 2009 3:38 PM
To: [log in to unmask]
Subject: Re: [TN] die base chip outs / fractures
I refer much to MIL-PRF-38535F and MIL-M-38510, even if both are not
very
in line with today's products.
/Inge
----- Original Message -----
From: "Steven Creswick" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, August 05, 2009 3:19 PM
Subject: Re: [TN] die base chip outs / fractures
> Victor,
>
> I am not sure what the IPC equivalent to MIL-STD-883 would be, but if
you
> refer to 883, TM 2010 - internal visual - monolithic, or TM 2017
internal
> visual - hybrid you may find what you are looking for.
>
> My recollection is that TM 2010 may provide the most info [para 3.1.3]
> although we were mostly concerned about chip-outs at the upper edge of
the
> chip, nearer to the active region. You might consider the section on
flip
> chips for info as well.
>
> If the chips are diced with a diamond saw, one seldom [if ever] sees
> chipping along the bottom edge of the die unless there has been
> mis-handling
> of the sawn wafer while still on the frame. Mainly, don't want cracks
> going
> in the direction of the active region of the chip - [personally, don't
> want
> to see cracks AT ALL - especially, if you can see them with a
low-power
> scope, etc].
>
> We would not want to see loose bits of Si rattling around inside a
sealed
> hybrid. If over-molded, it is not so likely to move anywhere...
>
> Interested in further detail of the chipping you are seeing.
>
> You should be able to down-load MIL-STD-883G from
> http://assist.daps.dla.mil/online/start/
> Once you get the user sign-on info. It is a ~6 Mb file
>
> Steve
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
> Sent: Wednesday, August 05, 2009 8:16 AM
> To: [log in to unmask]
> Subject: [TN] die base chip outs / fractures
>
> Fellow TechNetters:
>
> Is there an IPC documents pertaining to acceptance of anomalies with
> die. I am see small cracks/chip out at the die to die attach region.
> How much chip out/ crack is allowed?
>
> Victor,
>
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