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August 2009

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Subject:
From:
Victor Hernandez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 6 Aug 2009 08:38:10 -0500
Content-Type:
text/plain
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text/plain (144 lines)
I was not able to retrieve MIL-PRF-38535F from the data base, doc not
found.   MIL-M-38510 did not include photos/sketches of acceptance
anomalies.   Any other suggestions.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Wednesday, August 05, 2009 3:38 PM
To: [log in to unmask]
Subject: Re: [TN] die base chip outs / fractures

I refer much to MIL-PRF-38535F and MIL-M-38510,  even if both are not
very 
in line with today's products.

/Inge


----- Original Message ----- 
From: "Steven Creswick" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, August 05, 2009 3:19 PM
Subject: Re: [TN] die base chip outs / fractures


> Victor,
>
> I am not sure what the IPC equivalent to MIL-STD-883 would be, but if
you
> refer to 883, TM 2010 - internal visual - monolithic, or TM 2017
internal
> visual - hybrid you may find what you are looking for.
>
> My recollection is that TM 2010 may provide the most info [para 3.1.3]
> although we were mostly concerned about chip-outs at the upper edge of
the
> chip, nearer to the active region.  You might consider the section on
flip
> chips for info as well.
>
> If the chips are diced with a diamond saw, one seldom [if ever] sees
> chipping along the bottom edge of the die unless there has been 
> mis-handling
> of the sawn wafer while still on the frame.  Mainly, don't want cracks

> going
> in the direction of the active region of the chip - [personally, don't

> want
> to see cracks AT ALL - especially, if you can see them with a
low-power
> scope, etc].
>
> We would not want to see loose bits of Si rattling around inside a
sealed
> hybrid.  If over-molded, it is not so likely to move anywhere...
>
> Interested in further detail of the chipping you are seeing.
>
> You should be able to down-load MIL-STD-883G from
> http://assist.daps.dla.mil/online/start/
> Once you get the user sign-on info.  It is a ~6 Mb file
>
> Steve
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
> Sent: Wednesday, August 05, 2009 8:16 AM
> To: [log in to unmask]
> Subject: [TN] die base chip outs / fractures
>
> Fellow TechNetters:
>
>   Is there an IPC documents pertaining to acceptance of anomalies with
> die.   I am see small cracks/chip out at the die to die attach region.
> How much chip out/ crack is allowed?
>
> Victor,
>
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