TECHNET Archives

August 2009

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Inge <[log in to unmask]>
Date:
Wed, 5 Aug 2009 22:38:26 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (98 lines)
I refer much to MIL-PRF-38535F and MIL-M-38510,  even if both are not very 
in line with today's products.

/Inge


----- Original Message ----- 
From: "Steven Creswick" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, August 05, 2009 3:19 PM
Subject: Re: [TN] die base chip outs / fractures


> Victor,
>
> I am not sure what the IPC equivalent to MIL-STD-883 would be, but if you
> refer to 883, TM 2010 - internal visual - monolithic, or TM 2017 internal
> visual - hybrid you may find what you are looking for.
>
> My recollection is that TM 2010 may provide the most info [para 3.1.3]
> although we were mostly concerned about chip-outs at the upper edge of the
> chip, nearer to the active region.  You might consider the section on flip
> chips for info as well.
>
> If the chips are diced with a diamond saw, one seldom [if ever] sees
> chipping along the bottom edge of the die unless there has been 
> mis-handling
> of the sawn wafer while still on the frame.  Mainly, don't want cracks 
> going
> in the direction of the active region of the chip - [personally, don't 
> want
> to see cracks AT ALL - especially, if you can see them with a low-power
> scope, etc].
>
> We would not want to see loose bits of Si rattling around inside a sealed
> hybrid.  If over-molded, it is not so likely to move anywhere...
>
> Interested in further detail of the chipping you are seeing.
>
> You should be able to down-load MIL-STD-883G from
> http://assist.daps.dla.mil/online/start/
> Once you get the user sign-on info.  It is a ~6 Mb file
>
> Steve
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
> Sent: Wednesday, August 05, 2009 8:16 AM
> To: [log in to unmask]
> Subject: [TN] die base chip outs / fractures
>
> Fellow TechNetters:
>
>   Is there an IPC documents pertaining to acceptance of anomalies with
> die.   I am see small cracks/chip out at the die to die attach region.
> How much chip out/ crack is allowed?
>
> Victor,
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-615-7100 ext.2815
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to 
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to 
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 
> for additional information, or contact Keach Sasamori at [log in to unmask] or 
> 847-615-7100 ext.2815
> ----------------------------------------------------- 

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2