Yes, there are bond pad opening design rules for what type of bondwire you
will use.
example for Au wire: Design rule is 3 x wire diameter. If you will use 2
mils Au wire, then the bond pad should be 6 x 6 (mils) minimum. For
wedgebonding there is a rule for bond pad opening with respect to wedge
width and length.

regards

Jonathan Noquil
Package Design/Development
Power Stage BU
Texas Instruments




On Tue, Aug 4, 2009 at 11:36 PM, Steve Kelly <[log in to unmask]> wrote:

> Good Morning,
>
> Does the size of a wire bond pad (in this case with a perfect etch .002
> wide) have any effect on whether the wire bonder does Al wedge or
> Thermosonic gold( I know the gold plating is different) - just asking about
> the process. Thanks. Steve Kelly
>
>
>
> Steve Kelly (PLEASE NOTE NEW E-MAIL ADDRESS)
>
> (416) 750-8433 (work)
>
> (416) 750-0016 (fax)
>
> (416) 577-8433 (cell)
>
>
>
>
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