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| Date: | Tue, 4 Aug 2009 22:39:55 +0200 |
| Content-Type: | text/plain |
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Roger
----- Original Message -----
From: "Steve Kelly" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, August 04, 2009 10:24 PM
Subject: Re: [TN] Wire bond
> Thanks Inge. Steve
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
> Sent: August-04-09 2:08 PM
> To: [log in to unmask]
> Subject: Re: [TN] Wire bond
>
> No problem
>
> / Inge
>
> ----- Original Message -----
> From: "Steve Kelly" <[log in to unmask]>
> To: "'TechNet E-Mail Forum'" <[log in to unmask]>; "'Inge'"
> <[log in to unmask]>
> Sent: Tuesday, August 04, 2009 7:55 PM
> Subject: RE: [TN] Wire bond
>
>
>> Hi Inge
>> - flex? - 18 micron copper on adhesiveless kapton - stiffener
>> underneath.
>> Regards Steve
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
>> Sent: August-04-09 1:52 PM
>> To: [log in to unmask]
>> Subject: Re: [TN] Wire bond
>>
>> Ceramic : No
>> FR-4 : No
>> LTCC: No
>> Glass: No
>> Steel: No
>> Teflon: Yes
>>
>> /Inge
>>
>>
>> ----- Original Message -----
>> From: "Steve Kelly" <[log in to unmask]>
>> To: <[log in to unmask]>
>> Sent: Tuesday, August 04, 2009 5:36 PM
>> Subject: [TN] Wire bond
>>
>>
>> Good Morning,
>>
>> Does the size of a wire bond pad (in this case with a perfect etch .002
>> wide) have any effect on whether the wire bonder does Al wedge or
>> Thermosonic gold( I know the gold plating is different) - just asking
>> about
>> the process. Thanks. Steve Kelly
>>
>>
>>
>> Steve Kelly (PLEASE NOTE NEW E-MAIL ADDRESS)
>>
>> (416) 750-8433 (work)
>>
>> (416) 750-0016 (fax)
>>
>> (416) 577-8433 (cell)
>>
>>
>>
>>
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>> or
>> 847-615-7100 ext.2815
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>> for additional information, or contact Keach Sasamori at [log in to unmask]
>> or
>> 847-615-7100 ext.2815
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>>
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text in
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> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
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> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-615-7100 ext.2815
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
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> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-615-7100 ext.2815
> -----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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