No problem

/ Inge

----- Original Message ----- 
From: "Steve Kelly" <[log in to unmask]>
To: "'TechNet E-Mail Forum'" <[log in to unmask]>; "'Inge'" 
<[log in to unmask]>
Sent: Tuesday, August 04, 2009 7:55 PM
Subject: RE: [TN] Wire bond


> Hi Inge
> - flex? -  18 micron copper on adhesiveless kapton - stiffener underneath.
> Regards Steve
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
> Sent: August-04-09 1:52 PM
> To: [log in to unmask]
> Subject: Re: [TN] Wire bond
>
> Ceramic : No
> FR-4 : No
> LTCC: No
> Glass: No
> Steel:  No
> Teflon: Yes
>
> /Inge
>
>
> ----- Original Message ----- 
> From: "Steve Kelly" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Tuesday, August 04, 2009 5:36 PM
> Subject: [TN] Wire bond
>
>
> Good Morning,
>
> Does the size of a wire bond pad (in this case with a perfect etch .002
> wide) have any effect on whether the wire bonder does Al wedge or
> Thermosonic gold( I know the gold plating is different) - just asking 
> about
> the process. Thanks. Steve Kelly
>
>
>
> Steve Kelly (PLEASE NOTE NEW E-MAIL ADDRESS)
>
> (416) 750-8433 (work)
>
> (416) 750-0016 (fax)
>
> (416) 577-8433 (cell)
>
>
>
>
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> 

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