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Date: | Tue, 4 Aug 2009 13:55:13 -0400 |
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Hi Inge
- flex? - 18 micron copper on adhesiveless kapton - stiffener underneath.
Regards Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: August-04-09 1:52 PM
To: [log in to unmask]
Subject: Re: [TN] Wire bond
Ceramic : No
FR-4 : No
LTCC: No
Glass: No
Steel: No
Teflon: Yes
/Inge
----- Original Message -----
From: "Steve Kelly" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, August 04, 2009 5:36 PM
Subject: [TN] Wire bond
Good Morning,
Does the size of a wire bond pad (in this case with a perfect etch .002
wide) have any effect on whether the wire bonder does Al wedge or
Thermosonic gold( I know the gold plating is different) - just asking about
the process. Thanks. Steve Kelly
Steve Kelly (PLEASE NOTE NEW E-MAIL ADDRESS)
(416) 750-8433 (work)
(416) 750-0016 (fax)
(416) 577-8433 (cell)
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