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August 2009

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Subject:
Re: Wire bond
From:
Inge <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Inge <[log in to unmask]>
Date:
Tue, 4 Aug 2009 19:51:39 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (61 lines) 
Ceramic : No
FR-4 : No
LTCC: No
Glass: No
Steel:  No
Teflon: Yes

/Inge


----- Original Message ----- 
From: "Steve Kelly" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, August 04, 2009 5:36 PM
Subject: [TN] Wire bond


Good Morning,

Does the size of a wire bond pad (in this case with a perfect etch .002 
wide) have any effect on whether the wire bonder does Al wedge or 
Thermosonic gold( I know the gold plating is different) - just asking about 
the process. Thanks. Steve Kelly



Steve Kelly (PLEASE NOTE NEW E-MAIL ADDRESS)

(416) 750-8433 (work)

(416) 750-0016 (fax)

(416) 577-8433 (cell)




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