TECHNET Archives

August 2009

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Steven Creswick <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steven Creswick <[log in to unmask]>
Date:
Tue, 4 Aug 2009 13:30:33 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (177 lines)
Wayne,

Amen with respect to wedge bonding having its own issues!  

We can gold bond to ENIPEG - all non-electrolytic.  Just takes a slightly
different set-up.  I will not necessarily go on record saying that ALL of
these tiny pads will plate absolutely the same way, however.  That is a
plating issue.

Steve


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Thayer, Wayne - IIW
Sent: Tuesday, August 04, 2009 1:17 PM
To: [log in to unmask]
Subject: Re: [TN] Wire bond

Gold bonding requires electroplated gold.  Either the electroplating will be
done with "buss bars" or the outer layers will be pattern plated with gold.

If pattern plating, the gold stays there, and you will have under-cutting of
the pads which will be at least as much as the thickness of the copper under
the gold.  Not many fabs know how to check that, so most stuff comes out way
over-etched (but that nice gold on the surface looks great--until it falls
off!).

Aluminum bonds to copper just fine, so this isn't an issue.  Even ImAg works
pretty well to protect the copper from oxidation.  But wedge bonding has its
own issues--decreased speed, more brittle wires, more difficult looping,
etc.)

Wayne Thayer

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Kelly
Sent: Tuesday, August 04, 2009 1:02 PM
To: [log in to unmask]
Subject: Re: [TN] Wire bond

Hi Joyce,
Do not understand your response - why would a .002 etched pad be flatter in
the centre - I have done thousands of x-sections and SEMS - never seen this.
Why would I have exposed copper at an edge- never built a wire bond circuit
that would have that issue. Regards Steve

Steve Kelly
PFC Flexible Circuits Limited
PH: (416) 750-8433
Fax: (416) 750-0016
Cell: (416) 577-8433

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Tuesday, August 04, 2009 12:56 PM
To: [log in to unmask]
Subject: Re: [TN] Wire bond

Yap.  The flatness of the center pads is better than the edge, just in case
you have some exposed copper at the edge, that will harden the gold locally.

--------------------------
Sent using BlackBerry


----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Tue Aug 04 11:36:30 2009
Subject: [TN] Wire bond

Good Morning,

Does the size of a wire bond pad (in this case with a perfect etch .002
wide) have any effect on whether the wire bonder does Al wedge or
Thermosonic gold( I know the gold plating is different) - just asking about
the process. Thanks. Steve Kelly



Steve Kelly (PLEASE NOTE NEW E-MAIL ADDRESS)

(416) 750-8433 (work)

(416) 750-0016 (fax)

(416) 577-8433 (cell)




---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------------------------
This transmission (including any attachments) may contain confidential
information, privileged material (including material protected by the
solicitor-client or other applicable privileges), or constitute non-public
information. Any use of this information by anyone other than the intended
recipient is prohibited. If you have received this transmission in error,
please immediately reply to the sender and delete this information from your
system. Use, dissemination, distribution, or reproduction of this
transmission by unintended recipients is not authorized and may be unlawful.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

This e-mail and any files transmitted with it may be proprietary and are
intended solely for the use of the individual or entity to whom they are
addressed. If you have received this e-mail in error please notify the
sender.
Please note that any views or opinions presented in this e-mail are solely
those of the author and do not necessarily represent those of ITT
Corporation. The recipient should check this e-mail and any attachments for
the presence of viruses. ITT accepts no liability for any damage caused by
any virus transmitted by this e-mail.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2