Hi Joyce,
Do not understand your response - why would a .002 etched pad be flatter in
the centre - I have done thousands of x-sections and SEMS - never seen this.
Why would I have exposed copper at an edge- never built a wire bond circuit
that would have that issue. Regards Steve

Steve Kelly
PFC Flexible Circuits Limited
PH: (416) 750-8433
Fax: (416) 750-0016
Cell: (416) 577-8433

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Tuesday, August 04, 2009 12:56 PM
To: [log in to unmask]
Subject: Re: [TN] Wire bond

Yap.  The flatness of the center pads is better than the edge, just in case
you have some exposed copper at the edge, that will harden the gold locally.

--------------------------
Sent using BlackBerry


----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Tue Aug 04 11:36:30 2009
Subject: [TN] Wire bond

Good Morning,

Does the size of a wire bond pad (in this case with a perfect etch .002
wide) have any effect on whether the wire bonder does Al wedge or
Thermosonic gold( I know the gold plating is different) - just asking about
the process. Thanks. Steve Kelly



Steve Kelly (PLEASE NOTE NEW E-MAIL ADDRESS)

(416) 750-8433 (work)

(416) 750-0016 (fax)

(416) 577-8433 (cell)




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